Intel’s 3D engraved Lakefield chips are here for ARM to accept laptops, tablets and folders
Intel’s 3D-Stacked Lakefield processors are finally getting their official debut months after previews, promising to bring smaller, more versatile chipset hardware for hardware manufacturers to new ultra-compact, foldable, and two-way devices. until now: ARM:
The new Intel Core processors with Intel Hybrid Technology (an official name that almost guarantees that people will continue to call them Lakefield chips) for the first time discuss the two main technologies of its chipets: hybrid cores and more compact fixed Foveros 3D formatting. :
The new chips are designed to flow smaller, ultraviolet devices, the first three of which are already known. Intel version of Galaxy Book S: (previously with ARM model powered by Qualcomm Snapdragon 8cx), folding Lenovo ThinkPad X1 Fold and dual-sided Surface Neo.
The hybrid base is powered by a more powerful Core class Sunny Cove core (based on the same 10nm architecture based on the 10th ice lake chips) with four low-energy Atom class Tremont cores (a total of five five cores and five threads) per death. on This arrangement allows for balance of energy, efficiency, and battery life that could be achieved with pure Core or pure Atom configuration.
If such a composition of chips seems familiar, it is because it is surprisingly similar ARM’s Big.Little architectureused for Qualcomm’s Snapdragon, Samsung’s Exynos և Huawei’s Kirin chipsets for mobile phones, tablets և even laptops. In other words, the new Lakefield chips represent all of Intel’s efforts to resist ARM chipsets due to the comparable factors of a comparable laptop and a tablet.
That’s where the other big innovation of Lakefield chips comes in. Intel’s 3D Foveros storage technology, which allows for much more compact packaging than traditional designs. Lakefield chips are divided into three layers. The two logically die, containing five processor cores, various I / O elements needed to run Intel’s integrated UHD Graphics GPU: computer. The third package of DRAM, which helps to further reduce the space. Everyone said that Intel says that the new chips in Lakefield provide “56 percent less pack space for up to 47 small boards,” compared to the Intel Core i7-8500Y processor.
To get started, Intel is considering two 7W Lakefield two chips: Core i5-L16G7 and Core i3-L13G4. And because they share the architecture of Intel’s latest 10th-century iceberg chips, both new chips use common features such as Intel’s Gen11 integrated graphics and support for Wi-Fi 6. The Core i5-L16G7 is obviously faster, 1.4 GHz base frequency, 3.0GHz single-core turbo boost speed և 1.8 GHz frequency. Core i3-L13G4 has a base frequency of 0.8GHz, 2.8GHz single-speed turbo booster և 1.3GHz total nuclear frequency.
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